Sputtering Equipment Multifunctional Sputter Device MiniLab-S060A
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
4 units of Φ2 inch cathodes installed Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen with the plasma relay switch 3 systems of MFC (Ar, O2, N2) for reactive sputtering Plasma etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● It is also possible to configure a mixed specification for resistance heating deposition, organic material deposition, EB deposition, etc.
- Company：テルモセラ・ジャパン 本社
- Price：Other
